WDS- 750 BGA Machine

Availability: In Order Available

SKU: WDS_750_BGA_Rework_Station

Brand: Other

Product Details

your order will be ready in  (10-20 days) after order is placed
Repair steps:

1)      Separate the BGA chip from mother board –we called desoldering
2)      Clean Pad
3)      Reballing  or replace a new BGA chip directly
4)      Alignment/Positioning – Depend on experience ,silk frame ,optical camera
5)      replace a new BGA chip - we called Soldering

WDS-750 SMD BGA rework station Parameters:-

Power

6800w

Up & Down heater power

1200w

IR heater power

4200w(2400w control)

Thermo-couple Ports

4 pcs

Position way

Optical lens+ Vshape holder+laser positioning

Material

High sensitive touch screen+temperature control module+PLC+step drive

PCB Size

Max:500×450mm , Min: 10×10mm

BGA size

0.8mm-8cm

PCB thickness

0.5-8 mm 

Min.chips pitch

0.15mm 

Mounting BGA weight

1000G 

Optical alignment lens

Motor drive can move front back right left

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